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TG-G3.0-01

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hi-res photo package (2584 kb)
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website image (55 kb)
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Thermal compund (grease) for heatsinks

Helps the heat dissipation from a CPU, chipset or processor to a heatsink

Excellent thermal impedance

Perfect stability - will not separate, run, migrate, or bleed

Non capacitive or electrically conductive

Additional information
additional info TG-G series datasheet (1679 kb)

Specifications
Weight: 3.0 g
Color: gray
Thermal conductivity: > 4.5 W / mK
Thermal Impedance <0.205 ° C-in2 / W
Density: > 2.5
Evaporation: <0.001 %
Volatility: <0.005 %
The dielectric constant: > 5.1
Dissipation Factor: <0.005
Viscosity: 76 CPS
Thixotropic index: 310 ± 10 ° C
Operating Temperature: -50 ~ 240 ° C
Composites: 50% silicone compounds
Compounds: 30% of carbon
The compounds of metal oxides: 20%

Certificates
certificate (1440 kb)
CE Certificate (pdf file)

Packing details
Q'ty in crtn, pcs	100
Crtn volume, CUM	0.041496
Crtn weight, kgs	3.34
Individual package size LxWxH:	180x120x15 mm
Carton size LxWxH:	390x380x280 mm
Country of origin	CN
Barcode	8716309083133
Customs code	3402909000
Packaging	blister

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